Electronic components encapsulation method, involves forming resin layer between welding balls, thinning another resin layer, gluing adhesive band on latter resin layer, and cutting structure into individual electronic chips

摘要

The method involves forming hooking blocks (36) on a lower face of a semiconductor wafer e.g. silicon substrate, and forming welding balls (38) on the formed hooking blocks. A resin layer (40) is formed between the welding balls, where the resin layer does not cover the welding balls. Another resin layer is thinned, and an adhesive band (46) is glued on the latter resin layer, where the resin layer has thickness that ranges between 400 and 800 micro meter. A structure is cut into individual electronic chips (28).