PHOTOELECTRIC MIX-LOADED PACKAGE, METHOD OF MANUFACTURING THE SAME, PHOTOELECTRIC MIX-LOADED PACKAGE WITH OPTICAL ELEMENT AND PHOTOELECTRIC MIX-LOADED MODULE

摘要

PROBLEM TO BE SOLVED: To provide a photoelectric mix-loaded package capable of being precisely positioned, in which the optical axis is not shifted and the transmission loss of light is small.;SOLUTION: A photoelectric mix-loaded package 41 is provided with a wiring board 10, an optical element connecting terminal 55 and an optical waveguide structure part 82. An optical waveguide structure part hole 81 and a positioning guide hole 51 capable of inserting a guide pin 52 which is inserted into a guide hole of an optical connector 91 having an optical path conversion part 93, which is connected to the tip of an optical transmission medium 92 and changes the path of the light propagating in the optical waveguide structure part 82, are formed on the wiring board 10. The optical element connecting terminal 55 is arranged near the opening of the optical waveguide structure part hole 81 on the main face 12 side. The optical waveguide structure part 82 has a core 83 and a clad 84 surrounding the core 83 and is formed in the optical waveguide structure part hole 81. The positioning guide hole 51 and the core 83 in the optical waveguide structure part 82 are both formed with reference to the same position reference conductor 56.;COPYRIGHT: (C)2012,JPO&INPIT