PLATED MEMBER FOR PREVENTING OCCURRENCE OF WHISKER IN BENDING PART, ELECTRIC ELECTRONIC COMPONENT USING THE SAME, METHOD FOR PRODUCING PLATED MEMBER, AND METHOD FOR PREVENTING OCCURRENCE OF WHISKER IN PLATED MEMBER

摘要

PROBLEM TO BE SOLVED: To provide a plated member in which high solderability (wettability) to lead-free solder is achieved and the occurrence of whisker particularly in the severe bending part thereof can be suppressed or prevented, and to provide a method for forming the bending part of the plated member and a method for preventing the occurrence of whisker.;SOLUTION: The plated member is obtained by subjecting a multilayer plated material to reflow treatment and bending it at a bending part located between flat parts. The multilayer plated material has, on a conductive substrate, a second plated layer of indium at the top and a first plated layer below the second plated layer through or without other layers. In the multilayer plated material before the reflow treatment, the thickness (t₁) of the first plated layer and the thickness (t₂) of the second plated layer are set within a specific range and a specific diffusion layer of In is formed to prevent the occurrence of whisker.;COPYRIGHT: (C)2012,JPO&INPIT