首页> 外国专利> SURFACE COATED CUTTING TOOL IN WHICH HARD COVERING LAYER EXHIBITS SUPERIOR PEELING RESISTANCE AND SUPERIOR CHIPPING RESISTANCE IN INTERMITTENTLY CUTTING HARD DIFFICULT-TO-CUT MATERIAL

SURFACE COATED CUTTING TOOL IN WHICH HARD COVERING LAYER EXHIBITS SUPERIOR PEELING RESISTANCE AND SUPERIOR CHIPPING RESISTANCE IN INTERMITTENTLY CUTTING HARD DIFFICULT-TO-CUT MATERIAL

机译:硬覆盖层展览中的表面涂层切削工具,在间歇切削硬难切削材料时表现出超强的抗起皮性和抗切削性

摘要

PROBLEM TO BE SOLVED: To provide a surface coated cutting tool in which a hard covering layer exhibits superior peeling resistance and superior chipping resistance in intermittently cutting a hard difficult-to-cut material.;SOLUTION: The cutting tool is formed by coating an uppermost surface of a tool substrate constituted of a tungsten carbide based cemented carbide or titanium carbonitride based cermet with at least an Nb boride layer with an average layer thickness of 0.5-5 μm. In the cutting tool, the Nb boride layer is constituted as a composition structure of a crystalline grain structure with multiple average grain sizes. The composition structure is constituted of: a secondary crystalline grain constituted of an aggregate of a primary crystalline grain with an average grain size of 5-20 nm and having an average grain size of 40-80 nm; and a tertiary crystalline grain constituted of an aggregate of the secondary crystalline grain and having an average grain size of 150-800 nm.;COPYRIGHT: (C)2012,JPO&INPIT
机译:要解决的问题:提供一种表面涂层的切削工具,其中的硬质覆盖层在断续切削难切削的硬质材料时显示出优异的抗剥离性和出色的抗崩裂性。由碳化钨基硬质合金或碳氮化钛基金属陶瓷构成的工具基板的表面,其具有至少Nb硼化物层,其平均层厚度为0.5-5μm。在切削工具中,Nb硼化物层构成为具有多个平均晶粒尺寸的晶粒结构的组成结构。组成结构由以下组成:第二晶粒由平均晶粒尺寸为5-20nm且平均晶粒尺寸为40-80nm的一次晶粒的聚集体构成; ;第二晶粒由第二晶粒的聚集体构成,平均晶粒尺寸为150-800 nm 。;版权所有:(C)2012,JPO&INPIT

著录项

  • 公开/公告号JP2012115967A

    专利类型

  • 公开/公告日2012-06-21

    原文格式PDF

  • 申请/专利权人 MITSUBISHI MATERIALS CORP;

    申请/专利号JP20100270102

  • 发明设计人 KAKINUMA HIROAKI;TANAKA YUSUKE;

    申请日2010-12-03

  • 分类号B23B27/14;B23C5/16;B23B51/00;C23C14/06;

  • 国家 JP

  • 入库时间 2022-08-21 17:43:40

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