首页> 外国专利> PHOSPHORUS-CONTAINING CURING AGENT, EPOXY RESIN COMPOSITION, PREPREG, RESIN FILM WITH SUPPORT, METAL FOIL-CLAD LAMINATE AND MULTILAYER PRINTED WIRING BOARD

PHOSPHORUS-CONTAINING CURING AGENT, EPOXY RESIN COMPOSITION, PREPREG, RESIN FILM WITH SUPPORT, METAL FOIL-CLAD LAMINATE AND MULTILAYER PRINTED WIRING BOARD

机译:含磷固化剂,环氧树脂组合物,预浸料,带支撑树脂膜,金属箔层压板和多层印刷线路板

摘要

PROBLEM TO BE SOLVED: To provide a phosphorus-containing curing agent capable of providing an epoxy resin composition imparted with properties including high heat resistance, flame retardancy and water resistance; and to provide an epoxy resin composition, a prepreg, a resin film with a support, a metal foil-clad laminate and a multilayer printed wiring board for a printed wiring board and using the curing agent.;SOLUTION: The phosphorus-containing curing agent is obtained by reacting a compound A represented by chemical formula (1) with a compound B having a phenolic hydroxyl group. In the formula, R1 denotes a 0-6C hydrocarbon group, and here, the hydrocarbon group having no carbon atoms in R1 refers to a direct bond of Cl to P. There are also provided an epoxy resin composition, a prepreg, a resin film with a support, a metal foil-clad laminate and a multilayer printed wiring board using the curing agent.;COPYRIGHT: (C)2012,JPO&INPIT
机译:解决的问题:提供一种含磷固化剂,其能够提供具有高耐热性,阻燃性和耐水性的特性的环氧树脂组合物。并提供环氧树脂组合物,预浸料,带支撑物的树脂膜,覆金属箔的层压板和用于印刷线路板并使用固化剂的多层印刷线路板。;解决方案:含磷固化剂通过使化学式(1)表示的化合物A与具有酚羟基的化合物B反应而获得。式中,R 1 表示0-6C的烃基,此处,R 1 中不具有碳原子的烃基是Cl与P的直接键。还提供了一种环氧树脂组合物,一种预浸料,一种带有支撑物的树脂膜,一种覆有金属箔的层压板以及一种使用固化剂的多层印刷线路板。版权所有:(C)2012,JPO&INPIT

著录项

  • 公开/公告号JP2012012590A

    专利类型

  • 公开/公告日2012-01-19

    原文格式PDF

  • 申请/专利权人 HITACHI CHEM CO LTD;

    申请/专利号JP20110122802

  • 发明设计人 YANAGIDA MAKOTO;AITSU SHUJI;

    申请日2011-05-31

  • 分类号C08G59/40;C08J5/24;C08G8/28;B32B15/092;C07F9/6574;

  • 国家 JP

  • 入库时间 2022-08-21 17:43:14

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