首页> 外国专利> INSULATING AND THERMALLY-CONDUCTIVE RESIN COMPOSITION FOR EXTRUSION MOLDING AND EXTRUSION MOLDED PRODUCT USING THE SAME

INSULATING AND THERMALLY-CONDUCTIVE RESIN COMPOSITION FOR EXTRUSION MOLDING AND EXTRUSION MOLDED PRODUCT USING THE SAME

机译:绝缘和导热树脂组合物,用于挤塑和挤塑产品使用相同的

摘要

PROBLEM TO BE SOLVED: To provide an insulating and thermally-conductive resin composition that is suitable for extrusion molding by adding an acrylic molding modifier to a thermally-conductive resin for injection molding, and also to provide an extrusion molded product having good surface appearance, insulation properties, and thermal conductivity.SOLUTION: The thermal conductivity is at least 1 W/m.K when a thermally-conductive inorganic filler and at least two acrylic molding modifying aids that improve extrusion moldability are blended into a polymer matrix, and at least 25 vol% relative to the total is filled with the inorganic filler. The acrylic molding modifying aids include at least one acrylic polymer external lubricant and at least one acrylic polymer processing aid. At least one of the acrylic polymer processing aids includes an epoxy group and has an epoxy value in the range of 1.0 meq/g or less relative to the total acrylic molding modifying aids.
机译:解决的问题:为了提供一种适于通过在注射成型用导热性树脂中添加丙烯酸系成型改良剂而进行挤出成型的绝缘导热性树脂组合物,并且提供表面外观良好的挤出成型品,解决方案:当将导热无机填料和至少两种改善挤出成型性的丙烯酸类模塑改性助剂共混到聚合物基质中时,导热率至少为1 W / mK,至少25 vol相对于总量的%填充有无机填料。丙烯酸类模塑改性助剂包括至少一种丙烯酸类聚合物外部润滑剂和至少一种丙烯酸类聚合物加工助剂。丙烯酸类聚合物加工助剂中的至少一种包括环氧基,并且相对于全部丙烯酸类模塑改性助剂,其环氧值在1.0meq / g以下。

著录项

  • 公开/公告号JP2012171965A

    专利类型

  • 公开/公告日2012-09-10

    原文格式PDF

  • 申请/专利权人 STARLITE CO LTD;

    申请/专利号JP20110031851

  • 发明设计人 MONMA YUSUKE;

    申请日2011-02-17

  • 分类号C08L101/00;C08K3/00;C08L33/06;

  • 国家 JP

  • 入库时间 2022-08-21 17:43:01

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