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SURFACE-EMITTING LASER AND SURFACE-EMITTING LASER ARRAY, METHOD OF MANUFACTURING SURFACE-EMITTING LASER AND METHOD OF MANUFACTURING SURFACE-EMITTING LASER ARRAY, AND OPTICAL EQUIPMENT HAVING SURFACE-EMITTING LASER ARRAY
SURFACE-EMITTING LASER AND SURFACE-EMITTING LASER ARRAY, METHOD OF MANUFACTURING SURFACE-EMITTING LASER AND METHOD OF MANUFACTURING SURFACE-EMITTING LASER ARRAY, AND OPTICAL EQUIPMENT HAVING SURFACE-EMITTING LASER ARRAY
PROBLEM TO BE SOLVED: To provide a method of manufacturing a surface-emitting laser which is capable of forming a surface relief structure that enables the accurate positioning of the center position of the surface relief structure and that of a current constriction structure, and that can introduce a sufficient loss difference between a fundamental lateral mode and a high-order lateral mode.;SOLUTION: Removal of a dielectric film on a semiconductor layer and removal of a first etching stop layer along a second pattern are performed in the same process after formation of a current constriction structure by using second and third etching stop layers. A surface relief structure consists of three layers of a lower layer, an intermediate layer, and an upper layer. A total layer thickness of the lower layer, the intermediate layer, and the upper layer is defined as an optical thickness equivalent to odd-number times of 1/4 wavelength (odd-number times of /4n, is an oscillation wavelength, and n is a refractive index of the semiconductor layer). The second etching stop layer is provided immediately below the lower layer. The first etching stop layer is laminated immediately above the second etching stop layer.;COPYRIGHT: (C)2012,JPO&INPIT
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