PROCESS FOR TREATING SUBSTRATES FOR MICROELECTRONICS INDUSTRY, AND SUBSTRATES OBTAINED BY THIS PROCESS

摘要

PROBLEM TO BE SOLVED: To provide a process for treating a substrate which includes a working layer on at least one of its two faces and is used for the microelectronics or optoelectronics industry.SOLUTION: The process includes a step of annealing 200 under a reductive atmosphere 100 followed by a step of chemical-mechanical polishing on an exposed surface 54 of a working layer 52.