首页> 外国专利> DEVICE FOR POLISHING REAR SURFACE OF SUBSTRATE, SYSTEM FOR POLISHING REAR SURFACE OF SUBSTRATE AND METHOD FOR POLISHING REAR SURFACE OF SUBSTRATE, AND RECORDING MEDIUM HAVING RECORDED PROGRAM FOR POLISHING REAR SURFACE OF SUBSTRATE

DEVICE FOR POLISHING REAR SURFACE OF SUBSTRATE, SYSTEM FOR POLISHING REAR SURFACE OF SUBSTRATE AND METHOD FOR POLISHING REAR SURFACE OF SUBSTRATE, AND RECORDING MEDIUM HAVING RECORDED PROGRAM FOR POLISHING REAR SURFACE OF SUBSTRATE

机译:抛光基材后表面的装置,抛光基材后表面的系统和抛光基材后表面的方法,以及记录有记录程序以抛光基材后表面的方法

摘要

PROBLEM TO BE SOLVED: To prevent decrease in throughput or degradation in a substrate due to polishing of a rear surface of the substrate, and to reduce labor, time and cost necessary for replacing a polishing member.;SOLUTION: There are provided a rear substrate surface polishing device (9) polishing a rear surface of a substrate (5), a rear substrate surface polishing system (1) including the rear substrate surface polishing device (9), a rear substrate surface polishing method and a substrate rear surface polishing program used in the rear substrate surface polishing device (9). In particular, the rear surface of the substrate (5) is polished by substrate polishing means (16, 17) in accordance with information relating to the process on the substrate (5) in a prior step. Further, polishing is carried out by the polishing means (16, 17) in a polishing area determined on the basis of the information relating to the process on the substrate (5) in the prior step. Furthermore, the polishing is performed by using any one or all of a plurality of substrate polishing means (16, 17) determined on the basis of information relating to the process on the substrate (5) in the prior step.;COPYRIGHT: (C)2012,JPO&INPIT
机译:解决的问题:为了防止由于对基板的后表面进行抛光而导致基板的生产率降低或退化,并减少更换抛光构件所需的劳力,时间和成本。解决方案:提供了一种后基板面研磨装置(9)对基板(5)的背面进行研磨,具有背面基板表面研磨装置(9)的背面基板表面研磨系统(1),背面基板表面研磨方法以及基板背面研磨程序用于后基板表面抛光装置(9)。特别地,根据与在先前步骤中对基板(5)进行的处理有关的信息,通过基板抛光装置(16、17)对基板(5)的后表面进行抛光。此外,由抛光装置(16、17)在抛光区域中进行抛光,该抛光区域是基于与先前步骤中对基板(5)的处理有关的信息而确定的。此外,通过使用基于与在先前步骤中对基板(5)的处理有关的信息而确定的多个基板抛光装置(16、17)中的任何一个或全部来执行抛光。 )2012,JPO&INPIT

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