Below putting in place the wafer lamination Noetherian release

摘要

PROBLEM TO BE SOLVED: To provide a wafer laminator release film protection mechanism for adhering an overflowed adhesive on a wafer surface for removal.;SOLUTION: The wafer laminator release film protection mechanism includes: a lower chamber on which a wafer is placed; an upper chamber that is positioned at an upper part of the lower chamber and opens a plurality of pores; a conveyer roller that is extended between the upper and lower chambers, exchanges the position of a release film continuously, and winds an unused release film for installation; and a receiving roller for winding a used release film. An air supply device supplies air to the wafer installed in the lower chamber from the pore provided in the upper chamber, the release film positioned between the upper and lower chambers is affected by supplied air for adhering onto the wafer surface. After the supplied air stops, the release film separates from the wafer surface, and adheres the overflowed adhesive on the wafer surface for removal.;COPYRIGHT: (C)2011,JPO&INPIT