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ULTRASONIC VIBRATION JOINING DEVICE AND ULTRASONIC VIBRATION JOINING METHOD

机译:超声波振动接合装置及超声波振动接合方法

摘要

PROBLEM TO BE SOLVED: To provide a technology for readily applying ultrasonic vibrations in a plurality of different directions continuously by a simple structure without greatly changing an arranging direction of a joined object.;SOLUTION: Since the ultrasonic vibration is applied to a substrate 5a and a joining part by abutment of a joining tool 36a at a first joining position with upward (a first direction) movement of a resonator 32 by a drive unit 11, and the ultrasonic vibration is applied to a substrate 5b and a joining part by abutment of a joining tool 36b with downward (a second direction) movement of the resonator 32 by the drive unit 11, the ultrasonic vibrations can be readily applied in the plurality of different directions continuously by the simple structure in which the drive unit 11 for vertically moving the resonator 32 is provided even not altering greatly the orientation of the substrates 5a and 5b and a fin 6.;COPYRIGHT: (C)2012,JPO&INPIT
机译:解决的问题:提供一种通过简单的结构而在多个不同方向上连续连续施加超声波振动的技术,而又不大大改变被接合物的排列方向的问题。通过共振器32通过驱动单元11的向上(第一方向)移动,通过接合工具36a在第一接合位置处的抵接而使接合部36a与基板5b和接合部施加超声波振动。通过驱动单元11使谐振器32向下(第二方向)移动的连接工具36b,通过简单的结构可以容易地连续地在多个不同方向上施加超声波振动,在该简单的结构中,驱动单元11使振动单元32垂直移动。设置谐振器32,即使其不会大大改变基板5a和5b以及鳍6的取向。版权所有:(C)2012,JPO&INPIT

著录项

  • 公开/公告号JP2012024771A

    专利类型

  • 公开/公告日2012-02-09

    原文格式PDF

  • 申请/专利权人 ADWELDS:KK;

    申请/专利号JP20100162624

  • 发明设计人 NAKAI SEIYA;

    申请日2010-07-20

  • 分类号B23K20/10;

  • 国家 JP

  • 入库时间 2022-08-21 17:40:59

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