ULTRASONIC VIBRATION JOINING DEVICE AND ULTRASONIC VIBRATION JOINING METHOD
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机译:超声波振动接合装置及超声波振动接合方法
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摘要
PROBLEM TO BE SOLVED: To provide a technology for readily applying ultrasonic vibrations in a plurality of different directions continuously by a simple structure without greatly changing an arranging direction of a joined object.;SOLUTION: Since the ultrasonic vibration is applied to a substrate 5a and a joining part by abutment of a joining tool 36a at a first joining position with upward (a first direction) movement of a resonator 32 by a drive unit 11, and the ultrasonic vibration is applied to a substrate 5b and a joining part by abutment of a joining tool 36b with downward (a second direction) movement of the resonator 32 by the drive unit 11, the ultrasonic vibrations can be readily applied in the plurality of different directions continuously by the simple structure in which the drive unit 11 for vertically moving the resonator 32 is provided even not altering greatly the orientation of the substrates 5a and 5b and a fin 6.;COPYRIGHT: (C)2012,JPO&INPIT
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