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After production manner null of the microchip which possesses

机译:生产后拥有的微芯片无效

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of a microchip capable of forming a non-adhesive part without using a mask and applying a non-adhesive substance or a plasma-inactivated substance in case of manufacturing the microchip having the non-adhesive part.;SOLUTION: In the method of manufacturing the microchip having the non-adhesive part by subjecting a pasting surface of at least one of the first substrate and the second substrate, both being composed of a permanently bondable material, to surface modification treatment and then pasting both the substrates on each other, the first substrate is pasted on the second substrate while a portion of the outer surface of the first substrate which corresponds to a portion becoming the non-adhesive part, is lifted by a suction means, thereby keeping the portion becoming the non-adhesive part between both the substrates peeled off. After the activated state by the surface modification treatment disappears, the lift of the first substrate by the suction means is stopped to form the non-adhesive part.;COPYRIGHT: (C)2010,JPO&INPIT
机译:解决的问题:提供一种微芯片的制造方法,该微芯片的制造方法能够在不具有掩模的情况下形成非粘性部分并且在制造具有非粘性部分的微芯片的情况下施加非粘性物质或等离子体灭活物质。解决方案:在具有非粘合部分的微芯片的制造方法中,通过对第一基板和第二基板中的至少一个均由可永久粘合的材料组成的至少一个粘贴表面进行表面改性处理,然后将两个基板彼此粘贴在一起,将第一基板粘贴在第二基板上,同时通过抽吸装置将第一基板的外表面的一部分变成与非粘合部分相对应的部分,从而保持成为剥离的两个基板之间的非粘合部分的部分。在通过表面改性处理的激活状态消失之后,通过吸气装置停止对第一基板的提起,以形成非粘性部分。版权所有:(C)2010,JPO&INPIT

著录项

  • 公开/公告号JP5001203B2

    专利类型

  • 公开/公告日2012-08-15

    原文格式PDF

  • 申请/专利权人 アイダエンジニアリング株式会社;

    申请/专利号JP20080068903

  • 发明设计人 井上 政夫;井上 美智恵;

    申请日2008-03-18

  • 分类号B29C65/78;B81C3/00;G01N37/00;B01J19/00;B29C65/48;B29K21/00;B29K25/00;B29K83/00;

  • 国家 JP

  • 入库时间 2022-08-21 17:40:51

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