首页> 外国专利> PLATING SOLUTION FOR FORMING TIN ALLOY AND METHOD OF FORMING TIN ALLOY FILM USING THE SAME

PLATING SOLUTION FOR FORMING TIN ALLOY AND METHOD OF FORMING TIN ALLOY FILM USING THE SAME

机译:用于形成锡合金的镀液以及使用该溶液形成锡合金膜的方法

摘要

PROBLEM TO BE SOLVED: To provide a plating solution for forming a tin alloy, and to provide a method of forming a tin alloy film by using the plating solution.;SOLUTION: The plating solution for forming a tin alloy contains: one or more metal salts each containing indium or zinc; a tin sa and at least one reducing agent selected from the group consisting of boron hydride compounds, in which the reducing agent provides electrons to metal ions of the metal salts and tin ions of the tin salt to form a tin alloy film on an object to be plated.;COPYRIGHT: (C)2012,JPO&INPIT
机译:解决的问题:提供一种用于形成锡合金的镀液,并提供一种使用该镀液形成锡合金膜的方法。解决方案:用于形成锡合金的镀液包含:一种或多种金属分别含有铟或锌的盐;锡盐;至少一种选自氢化硼化合物的还原剂,其中,所述还原剂向所述金属盐的金属离子和所述锡盐的锡离子提供电子,从而在被镀物上形成锡合金膜。 ;版权:(C)2012,JPO&INPIT

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