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ELECTROLESS NICKEL PLATING BATH AND ELECTROLESS NICKEL PLATING METHOD USING THE SAME

机译:化学镀镍浴和使用该镀镍浴的化学镀镍方法

摘要

PROBLEM TO BE SOLVED: To provide an electroless nickel plating bath capable of forming a nickel plating film with low film stress, and to provide an electroless nickel plating method using the same.;SOLUTION: The plating film with low film stress can be formed by using the electroless nickel plating bath which contains metal antimony or an antimony compound as a stabilizer and contains succinic acid or one of a malic acid, and lactic acid, at a predetermined ratio as a complexing agent.;COPYRIGHT: (C)2012,JPO&INPIT
机译:解决的问题:提供一种能够形成低膜应力的镍镀膜的化学镀镍浴,并提供使用该方法的化学镀镍的方法。使用含有金属锑或锑化合物作为稳定剂,并以预定比例含有琥珀酸或苹果酸和乳酸中的一种作为络合剂的化学镀镍浴; COPYRIGHT:(C)2012,JPO&INPIT

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