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ELECTROLESS NICKEL PLATING BATH AND ELECTROLESS NICKEL PLATING METHOD USING THE SAME
ELECTROLESS NICKEL PLATING BATH AND ELECTROLESS NICKEL PLATING METHOD USING THE SAME
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机译:化学镀镍浴和使用该镀镍浴的化学镀镍方法
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摘要
PROBLEM TO BE SOLVED: To provide an electroless nickel plating bath capable of forming a nickel plating film with low film stress, and to provide an electroless nickel plating method using the same.;SOLUTION: The plating film with low film stress can be formed by using the electroless nickel plating bath which contains metal antimony or an antimony compound as a stabilizer and contains succinic acid or one of a malic acid, and lactic acid, at a predetermined ratio as a complexing agent.;COPYRIGHT: (C)2012,JPO&INPIT
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