ELECTROLESS NICKEL PLATING BATH AND ELECTROLESS NICKEL PLATING METHOD USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide an electroless nickel plating bath capable of forming a nickel plating film with low film stress, and to provide an electroless nickel plating method using the same.;SOLUTION: The plating film with low film stress can be formed by using the electroless nickel plating bath which contains metal antimony or an antimony compound as a stabilizer and contains succinic acid or one of a malic acid, and lactic acid, at a predetermined ratio as a complexing agent.;COPYRIGHT: (C)2012,JPO&INPIT