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In the thermometry tool which thermometry tool for the semiconductor production device, is locked by the thermometry manner of the semiconductor

机译:在该测温工具中,用于半导体生产装置的测温工具被半导体的测温方式锁定

摘要

PROBLEM TO BE SOLVED: To provide a temperature measuring tool which can convey a semiconductor wafer by an automatic conveyer in the same manner as an ordinary semiconductor wafer and can easily and precisely measure temperature during processing of a semiconductor wafer, to provide a method of measuring temperature for a semiconductor manufacturing apparatus using the temperature measuring tool, and to provide a semiconductor manufacturing apparatus which measures temperature by using the temperature measuring tool.;SOLUTION: The temperature measuring tool 10 is comprised of a substrate 11 made of a silicon wafer; a thermocouple 12 which is formed by using film formation method, photo lithograph method, and etching method; and a clamp pad (electrode pad) 13 which is arranged at the edge of the substrate 11, and is connected with the thermocouple 12. In the semiconductor manufacturing apparatus, its clamper pin (fixing jig) is brought into contact with the clamp pad 13, and the temperature measuring tool 10 is fixed to a wafer mounting part. The output of the thermocouple 12 is taken out to the outside through the clamper pin.;COPYRIGHT: (C)2008,JPO&INPIT
机译:解决的问题:提供一种温度测量工具,该温度测量工具可以通过自动传送器以与普通半导体晶片相同的方式传送半导体晶片,并且可以在半导体晶片的处理过程中容易且精确地测量温度,从而提供一种测量方法解决方案:温度测量工具10包括由硅晶片制成的基板11;温度测量工具10包括用于由温度测量工具测量的半导体制造设备的温度,以及提供一种通过温度测量工具测量温度的半导体制造设备。通过使用成膜法,光刻法和蚀刻法形成的热电偶12。在基板11的边缘配置有与热电偶12连接的夹持垫(电极垫)13。在半导体制造装置中,其夹持销(固定夹具)与夹持垫13接触。然后,将温度测量工具10固定在晶片安装部上。热电偶12的输出通过夹紧销引到外部。版权所有:(C)2008,JPO&INPIT

著录项

  • 公开/公告号JP5034327B2

    专利类型

  • 公开/公告日2012-09-26

    原文格式PDF

  • 申请/专利权人 富士通セミコンダクター株式会社;

    申请/专利号JP20060158024

  • 发明设计人 豊島 芳隆;

    申请日2006-06-07

  • 分类号H01L21/66;G01K7/00;H01L21/3065;H01L21/205;G01K1/14;G01K7/02;

  • 国家 JP

  • 入库时间 2022-08-21 17:39:44

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