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Cu-In-Ga ternary sintered alloy sputtering target manufacturing method of

机译:Cu-In-Ga三元烧结合金溅射靶的制造方法

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of a Cu-In-Ga ternary sintered alloy sputtering target, which is used for forming a Cu-In-Ga-Se quaternary alloy film for forming a light absorbing layer of a solar cell.;SOLUTION: A Cu-Ga binary mother alloy powder having a component composition containing, by mass, 20-50% Ga, and the balance Cu with inevitable impurities as raw material powder, Cu-In binary mother alloy powder having a component composition containing 20-70% In, and the balance Cu with inevitable impurities as raw material powder, and pure Cu powder are prepared. These raw material powders are blended and mixed so as to have a component composition containing, 40-60% In, 1-45% Ga, and the balance Cu to produce the mixed powder. The obtained mixed powder is press-formed to manufacture a formed body, and the obtained formed body is sintered.;COPYRIGHT: (C)2009,JPO&INPIT
机译:解决的问题:提供一种Cu-In-Ga三元烧结合金溅射靶的制造方法,该靶材用于形成用于形成太阳能电池的光吸收层的Cu-In-Ga-Se四元合金膜。 ;解决方案:一种Cu-Ga二元母合金粉末,其成分组成按质量计包含20%至50%的Ga,余量的Cu含不可避免的杂质作为原料粉末。制备In为20〜70%In,余量为不可避免的杂质的Cu和纯Cu粉。将这些原料粉末混合并混合以具有包含40-60%的In,1-45%的Ga和余量的Cu的成分组成,以制造混合粉末。将获得的混合粉末压制成型以制造成型体,然后对获得的成型体进行烧结。;版权所有:(C)2009,JPO&INPIT

著录项

  • 公开/公告号JP4957969B2

    专利类型

  • 公开/公告日2012-06-20

    原文格式PDF

  • 申请/专利权人 三菱マテリアル株式会社;

    申请/专利号JP20070292738

  • 发明设计人 大友 健志;小田 淳一;

    申请日2007-11-12

  • 分类号C23C14/34;C22C28/00;C22C9/00;C22C1/04;

  • 国家 JP

  • 入库时间 2022-08-21 17:39:03

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