首页> 外国专利> The copper foil in order to form the copper layer on the surface of the flexible copper-clad laminate null polyimide resin formation which can making use of the finishing

The copper foil in order to form the copper layer on the surface of the flexible copper-clad laminate null polyimide resin formation which can making use of the finishing

机译:铜箔是为了在柔性覆铜层压板的表面上形成铜层而形成的空聚酰亚胺树脂,可以利用精加工

摘要

PROBLEM TO BE SOLVED: To provide a surface treated copper foil which is used for forming a copper layer of a flexible copper clad laminate, enables formation of a fine pitch circuit, and shows good adhesion strength after heating.;SOLUTION: In the surface treated copper foil for manufacturing the flexible copper clad laminate for forming the copper layer on a surface of a polyimide resin layer, the copper foil has the surface treated layer of a cobalt layer or a laminate layer of a cobalt layer and a cobalt-zinc alloy layer on the adhesion surface with the polyimide resin layer.;COPYRIGHT: (C)2008,JPO&INPIT
机译:解决的问题:提供一种表面处理的铜箔,该箔用于形成柔性覆铜箔层压板的铜层,能够形成细间距的电路,并在加热后显示出良好的粘合强度。用于制造用于在聚酰亚胺树脂层的表面上形成铜层的柔性覆铜层压板的铜箔,该铜箔具有钴层的表面处理层或钴层和钴锌合金层的层压层。在与聚酰亚胺树脂层粘合的表面上。;版权所有:(C)2008,JPO&INPIT

著录项

  • 公开/公告号JP4958045B2

    专利类型

  • 公开/公告日2012-06-20

    原文格式PDF

  • 申请/专利权人 三井金属鉱業株式会社;

    申请/专利号JP20070165581

  • 发明设计人 小畠 真一;橋口 隆司;今 裕之;

    申请日2007-06-22

  • 分类号B32B15/088;H05K1/09;C23C28/00;H05K1/03;H05K3/38;H01L21/60;

  • 国家 JP

  • 入库时间 2022-08-21 17:39:00

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