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The copper foil in order to form the copper layer on the surface of the flexible copper-clad laminate null polyimide resin formation which can making use of the finishing
The copper foil in order to form the copper layer on the surface of the flexible copper-clad laminate null polyimide resin formation which can making use of the finishing
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机译:铜箔是为了在柔性覆铜层压板的表面上形成铜层而形成的空聚酰亚胺树脂,可以利用精加工
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摘要
PROBLEM TO BE SOLVED: To provide a surface treated copper foil which is used for forming a copper layer of a flexible copper clad laminate, enables formation of a fine pitch circuit, and shows good adhesion strength after heating.;SOLUTION: In the surface treated copper foil for manufacturing the flexible copper clad laminate for forming the copper layer on a surface of a polyimide resin layer, the copper foil has the surface treated layer of a cobalt layer or a laminate layer of a cobalt layer and a cobalt-zinc alloy layer on the adhesion surface with the polyimide resin layer.;COPYRIGHT: (C)2008,JPO&INPIT
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