首页> 外国专利> The 1st field of the mannered null IIIV substrate structure which forms the IIIV substrate structure which possesses with the enhancement

The 1st field of the mannered null IIIV substrate structure which forms the IIIV substrate structure which possesses with the enhancement

机译:柔和的无效IIIV衬底结构的第一场,形成具有增强作用的IIIV衬底结构

摘要

It is the semiconductor structure which has with the enhancement mode transistor device which is arranged in the 1st territory and the depression mode transistor device which is arranged in the 2nd territory which slips in cross direction. With respect to channel layer, enhancement mode transistor device InGaP etching stop/Schottky contact layer is arranged, the 1st layer which InGaP differs on InGaP layer, is arranged, with respect to 1st layer, depression mode transistor device etching stop layer is arranged, 2nd layer is arranged with respect to depression mode transistor device etching stop layer. The depression mode transistor device penetrates 2nd layer and depression mode transistor device etching stop layer and possesses the gate recess which terminates at 1st layer. The enhancement mode transistor device, 2nd layer and depression mode transistor device etching stop layer, penetrates 1st layer and possesses the gate recess which terminates at InGaP layer.
机译:具有配置在第一区域的增强模式晶体管装置和配置在横向滑动的第二区域的凹陷模式晶体管装置的半导体结构。相对于沟道层,配置增强型晶体管器件InGaP刻蚀停止层/肖特基接触层,在InGaP层上配置InGaP不同的第一层,相对于第一层,配置凹陷模式晶体管器件的刻蚀停止层,第二层相对于凹陷模式晶体管器件蚀刻停止层布置层。凹陷模式晶体管器件穿透第二层和凹陷模式晶体管器件蚀刻停止层,并具有终止于第一层的栅极凹槽。增强模式晶体管器件,第二层和凹陷模式晶体管器件蚀刻停止层,穿透第一层并具有终止于InGaP层的栅极凹槽。

著录项

  • 公开/公告号JP4913046B2

    专利类型

  • 公开/公告日2012-04-11

    原文格式PDF

  • 申请/专利权人 レイセオン カンパニー;

    申请/专利号JP20070515194

  • 发明设计人 ワン;キューチュル;

    申请日2005-05-19

  • 分类号H01L27/095;H01L21/338;H01L29/778;H01L29/812;

  • 国家 JP

  • 入库时间 2022-08-21 17:38:54

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