After in pattern formation manner of metal evaporation formation, and with respect to the metal evaporation

摘要

PROBLEM TO BE SOLVED: To provide a wet etching method where a correct pattern shape and excellent dimensional precision can be obtained by increasing adhesion between a metal-deposited layer and a resist ink for wet etching.;SOLUTION: In the method for forming a pattern comprising the steps of: pattern-stacking resist ink for wet etching on a metal-deposited layer provided on a base material; thermally drying the resist ink; and forming a pattern composed of a metal-deposited layer by wet etching, the resist ink comprises a binder resin and a compound (A) having a specified fundamental skeleton.;COPYRIGHT: (C)2007,JPO&INPIT