The perforation hole which from the aspect

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a through electrode substrate preventing deposition of metal particles in a through-hole in formation of a seed layer on the substrate with the through-hole formed and preventing generation of a void in charging of a conductive material in a method of manufacturing the through electrode substrate.;SOLUTION: In the method of manufacturing the through electrode substrate, the through-hole is formed through the substrate so as to extend from one surface to the other surface, a thin film as the seed layer is formed on one surface of the substrate while supplying gas into a reaction chamber of a sputtering device from the side of the other surface of the substrate through the through-hole and the conductive material is charged into the through-hole by electrolytic plating using the seed layer as a power supply layer to form the through electrode in the substrate.;COPYRIGHT: (C)2010,JPO&INPIT