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Being the thick film which possesses the production mannered null perforation hole of the thick film which possesses the perforation hole

机译:具有穿孔的厚膜具有生产上习惯的空孔的厚度

摘要

PROBLEM TO BE SOLVED: To produce a thick film with a through-hole at low cost and by a simple method.;SOLUTION: A thick film having through-holes 10h is formed by an aperture formation process for forming a thick film 11 which has temporary apertures 11h containing one or more portions for forming through-holes, and by a through-hole formation process for forming a thick film 12 while leaving through-holes 12h in the inside of the temporary apertures 11h.;COPYRIGHT: (C)2007,JPO&INPIT
机译:解决的问题:以低成本和简单的方法生产具有通孔的厚膜;解决方案:通过用于形成厚膜11的孔形成工艺形成具有通孔10h的厚膜。临时孔11h,其包含一个或多个用于形成通孔的部分,并且通过通孔形成工艺形成厚膜12,同时在临时孔11h的内部保留通孔12h 。;版权所有:(C)2007 ,JPO&INPIT

著录项

  • 公开/公告号JP4939030B2

    专利类型

  • 公开/公告日2012-05-23

    原文格式PDF

  • 申请/专利权人 株式会社リコー;

    申请/专利号JP20050298598

  • 发明设计人 川島 伊久衞;荒海 麻由佳;

    申请日2005-10-13

  • 分类号H05K3/46;

  • 国家 JP

  • 入库时间 2022-08-21 17:38:30

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