The chemical amplification die photoresist constituent for the thick film, the thick film photoresist layered product, in production manner of thick film resist pattern and on the production mannered null

摘要

PPROBLEM TO BE SOLVED: To provide a chemically amplified photoresist composition for a thick film suitable for forming a thick film having high sensitivity, ensuring good developed profile and suitable for use as a connection terminal forming material, and provide a thick film photoresist layered product, a method for producing a resist pattern usng the same and a method for producing a connection terminal. PSOLUTION: The chemically amplified photoresist composition used for forming a thick film photoresist layer of 20-150 μm thickness on a support comprises (a) a resin whose alkali solubility is varied by the action of an acid and (b) an N-sulfonyloxyimide compound which generates an acid upon irradiation with a radiation. PCOPYRIGHT: (C)2004,JPO