In CuCrSi based alloy and CuCrSi based alloy foil null mass factor

摘要

PROBLEM TO BE SOLVED: To provide a copper alloy and copper alloy foil for electrical/electronic components having high electrical conductivity while maintaining high strength.;SOLUTION: The high conductivity Cu-Cr-Si-based alloy for electrical/electronic components is a copper alloy comprising, by mass, 0.15 to 0.5% Cr and 0.02 to 0.15% Si, and the balance Cu with inevitable impurities, and, in which the mass ratio between the Cr addition and the Si addition, Cr/Si is 3.5 to 8.0, and the average grain diameter of precipitates present in the copper mother phase is 10 to 100 nm. If required, 0.02 to 0.1% Mg can be added thereto.;COPYRIGHT: (C)2008,JPO&INPIT