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MATERIAL PROCESSING METHOD USING LASER PULSE HAVING WIDE SPECTRUM BAND WIDTH, AND DEVICE FOR IMPLEMENTING THE METHOD
MATERIAL PROCESSING METHOD USING LASER PULSE HAVING WIDE SPECTRUM BAND WIDTH, AND DEVICE FOR IMPLEMENTING THE METHOD
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机译:具有宽谱带宽度的激光脉冲的材料加工方法及实现该方法的装置
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摘要
PROBLEM TO BE SOLVED: To create an easy and flexible method which enables specified processing and processing adapted to a requirement in terms of methodology while being applicable versatilely.;SOLUTION: There are provide the method and a device for processing a material by using a laser pulse having a wide spectrum band width, and a device for implementing the method. One of several spectrum parameters of the laser pulse are specifically modified in order to process the material, or during the processing according to, preferably, a measurement processing parameter. This invention is used for processing the material by using the laser pulse having the wide spectrum band width, particularly, a femtosecond pulse and a picosecond pulse.;COPYRIGHT: (C)2012,JPO&INPIT
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