The 1st process where it produces the single sided

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method for a multilayer printed-circuit board capable of reducing a manufacturing cost by decreasing a manufacturing process without the warp and breaking of the board or the infiltration of chemicals.;SOLUTION: The manufacturing method for the multilayer printed-circuit board contains a first process sticking a one-surface adhesive sheet with a pressure-sensitive adhesive layer on one surface of two both-surface copper-clad laminated board on one surface of the support base material as a thermoplastic resin at a heat-seal temperature of 150°C or lower while thermocompression-bonding the mutual supporting base materials and a second process circuit-machining both surfaces of the stuck copper-clad laminated board. The manufacturing method for the multilayer printed-circuit board further contains a third process blackening-processing both-circuit machining surfaces while laminating copper foils through prepreg and a fourth process peeling the adhesive sheets.;COPYRIGHT: (C)2010,JPO&INPIT