As the grinding pad and the chemical mechanical grinding device null slurry which

摘要

PROBLEM TO BE SOLVED: To provide a polishing pad for chemically and mechanically polishing a semiconductor substrate and a chemical mechanical polishing device employing it.;SOLUTION: A first group pattern 400 concentrically formed on the surface of the polishing pad, and a second group pattern 410 formed spirally from the center part toward the outside of the concentric circle in the surface of the polishing pad, are provided. A third group pattern 420 radially extending from the center part toward every sides in the surface of the polishing pad is further provided so as to be overlaid with the first group pattern 400 and the second group pattern 410.;COPYRIGHT: (C)2007,JPO&INPIT