Being the manner which decreases the optical proximity effect where the sensitization which is used at the time of photo mask processing and semiconductor treating

摘要

PROBLEM TO BE SOLVED: To reduce optical proximity effect in photomask fabrication, the manufacture of a semiconductor device or the fabrication of MEMS features on a substrate.;SOLUTION: A photoresist composition includes a sensitizer which works in combination with a DUV photoresist including a PAC, to sensitize the photoresist to G-line, H-line or I-line imaging.;COPYRIGHT: (C)2010,JPO&INPIT