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Seal arrival material formation equipped glass component and the production manner, and electronic device and that production manner

机译:装有密封件到达物形成的玻璃部件及其制造方式,电子设备及其制造方式

摘要

Seal arrival Characteristic and the reliability of the electronic device are raised by repeatability well raising bond strength of the glass substrate at the time of laser seal arrival. Glass substrate 3 has the seal field. It can provide the seal arrival material formation 5 which consists of the calcination formation of the seal wearing glass material which contains with seal arrival glass and low the expansion being full filler and the laser absorber in the seal field. Seal arrival glass includes 20 - 68% SnO, 0.5 - 5% SnO and 20 - 40% PO in mass proportion. As for seal arrival material formation 5 the carbon residue tonnage is made the range 20 - 1000ppm in mass proportion. This kind of glass substrate it laminates with the glass substrate 2 which, possesses the component formation field which has 3 and the electronic device irradiates laser light 6 to seal arrival material formation 5 and glass substrate between 2 and 3 the seal it sticks by melting.
机译:密封件的到达性通过反复提高激光密封件到达时的玻璃基板的粘接强度,提高了电子设备的特性和可靠性。玻璃基板3具有密封场。可以提供密封到达材料结构5,其由密封磨损玻璃材料的煅烧结构组成,该密封磨损玻璃材料包含密封到达玻璃并且在密封领域低膨胀为全填充剂和激光吸收剂。密封到达玻璃包括质量比为20-68%的SnO,0.5-5%的SnO和20-40%的PO。对于密封到达材料的形成5,以质量比例计,碳残留量为20〜1000ppm的范围。这种玻璃基板与具有具有3的部件形成区域的玻璃基板2层叠,并且电子设备照射激光6来密封到达材料形成部5和2到3之间的玻璃基板,并通过熔化使其粘住。

著录项

  • 公开/公告号JPWO2010071176A1

    专利类型

  • 公开/公告日2012-05-31

    原文格式PDF

  • 申请/专利权人 旭硝子株式会社;

    申请/专利号JP20100543002

  • 发明设计人 川浪 壮平;

    申请日2009-12-17

  • 分类号C03C8/14;C03C8/16;C03C8/18;C03C27/06;C03C27/10;H05B33/04;H05B33/10;H01L51/50;

  • 国家 JP

  • 入库时间 2022-08-21 17:36:27

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