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Methods of making substrate with metal film, the substrate with a metal film, methods of making metal pattern material, metal pattern material

机译:具有金属膜的基板的制造方法,具有金属膜的基板,金属图案材料的制造方法,金属图案材料

摘要

PROBLEM TO BE SOLVED: To provide a base board with a metallic film, which is less dependent on temperature and humidity, and a manufacturing method thereof; to provide a metallic pattern material, which is less dependent on temperature and humidity and is excellent in insulation reliability in a metallic pattern non-forming area, and a manufacturing method thereof.;SOLUTION: The manufacturing method of the base board with a metallic film has; (a1) a process in which a polymer layer is formed on a base board, the polymer layer comprising a polymer which has a multidentatable non-dissociative functional group, which forms interaction with a metal plating catalyst or its precursor, and chemically bonds directly with the base board; (a2) a process in which the multidentatable metal plating catalyst or its precursor is given to the polymer layer; and (a3) a process in which metal plating is made to the multidentatable metal plating catalyst or its precursor.;COPYRIGHT: (C)2008,JPO&INPIT
机译:解决的问题:提供一种基板,该基板具有较少地依赖温度和湿度的金属膜及其制造方法;提供一种金属图案材料及其制造方法,该金属图案材料对温度和湿度的依赖性较小,并且在金属图案非形成区域中的绝缘可靠性极好;解决方案:带金属膜的基板的制造方法具有; (a1)一种方法,其中在基板上形成聚合物层,该聚合物层包括具有多齿非解离性官能团的聚合物,该聚合物与金属镀覆催化剂或其前体形成相互作用,并与之直接化学键合。基板; (a2)将多齿金属镀敷催化剂或其前体赋予聚合物层的方法。 (a3)对多齿金属镀覆催化剂或其前体进行金属镀覆的方法。版权所有:(C)2008,日本特许经营&INPIT

著录项

  • 公开/公告号JP4903528B2

    专利类型

  • 公开/公告日2012-03-28

    原文格式PDF

  • 申请/专利权人 富士フイルム株式会社;

    申请/专利号JP20060287881

  • 发明设计人 永▲崎▼ 秀雄;加納 丈嘉;

    申请日2006-10-23

  • 分类号B05D3/10;C23C18/18;H05K3/18;

  • 国家 JP

  • 入库时间 2022-08-21 17:36:23

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