PROBLEM TO BE SOLVED: To provide a method and device for mounting by which a highly reliable joined state can be obtained finally with extremely high accuracy and which can be applied ideally to the bonding method at ambient temperature.;SOLUTION: When a plurality of objects to be joined are joined to each other by the mounting method, the first object to be joined, its holding means, the second object to be joined, its holding means, and a backup member having a positioning reference plane, are separately arranged in this order. After the first and second objects are temporarily joined to each other by bringing the first object into contact with the second object by adjusting the parallelism of the second object or its holding member to the reference plane of the backup member and the parallelism of the first object or its holding means to the second object or its holding means, both the objects are properly joined to each other by bringing the holding means of the second object into contact with the positioning reference plane of the backup member and pressing both objects against each other.;COPYRIGHT: (C)2002,JPO
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