In the film metal layered product which the film metal layered product, the production manner, formed foundation metal formation on the high-molecular film which possesses

摘要

PROBLEM TO BE SOLVED: To provide a film metal laminate which is suitable for a flexible circuit board, and excellent in bending resistance and adhesiveness.;SOLUTION: In the film metal laminate, a base metal layer is deposited on a flexible polymer film, and an upper metal conductive layer is deposited thereon, and the base metal layer consists of a nickel alloy containing ≥10 mass% phosphorus. The Ni-P alloy has excellent adhesiveness with the film, and the hardness thereof is not increased during the heat treatment for enhancing the adhesiveness, resulting in excellent adhesiveness and bending resistance.;COPYRIGHT: (C)2008,JPO&INPIT