The ink for the etched circuit baseplate which uses the adhesive composition and the said adhesive composition which use the polyamide imido resin and the said resin, the cover ray film, the adhesive seat and the etched circuit baseplate

摘要

Topic This invention low temperature gluing being possible, was superior in resistance solder characteristic after the adhesiveness and the humidification processing and resistance migration quality under hot high moisture, the useful adhesive composition and the gluing seat and the etched circuit baseplate which uses these are offered to the especially circuit baseplate.SolutionsLogarithm viscosity is above 0.2dl/g, the polyamide imido resin which possesses the⁶ carboxyl group in the side chain whose at the same time⁶ acid value is 400 equivalent /10g - 1000 equivalence /10g. Selective figure It is not