首页> 外国专利> MULTILAYER STRUCTURE WITH FLEXIBLE BASE MATERIAL AND SUPPORT, PANEL FOR USE IN ELECTRONIC DEVICE PROVIDED WITH SUPPORT AND PRODUCTION METHOD FOR PANEL FOR USE IN ELECTRONIC DEVICE

MULTILAYER STRUCTURE WITH FLEXIBLE BASE MATERIAL AND SUPPORT, PANEL FOR USE IN ELECTRONIC DEVICE PROVIDED WITH SUPPORT AND PRODUCTION METHOD FOR PANEL FOR USE IN ELECTRONIC DEVICE

机译:具有柔性基体材料和支撑的多层结构,用于电子设备的面板以及用于电子设备的面板的支持和生产方法

摘要

The present invention relates to a laminated structure including: a flexible base material having a first main surface and a second main surface and having a thickness of 0.3 mm or less; a supporting substrate; and a cured silicone resin layer provided between the flexible base material and the supporting substrate and having a peelable surface, in which the cured silicone resin layer is fixed onto a first main surface of the supporting substrate, has easy peelability against the first main surface of the flexible base material, and is adhered closely to the first main surface of the flexible base material.
机译:本发明涉及一种层压结构,其包括:具有第一主表面和第二主表面并且厚度为0.3mm或更小的柔性基材;支撑基板;固化的有机硅树脂层设置在挠性基材与支撑基板之间,并且具有可剥离的表面,其中固化的有机硅树脂层固定在支撑基板的第一主表面上,该有机硅树脂层易于相对于第一主表面剥离。柔性基材,并且紧密粘附到柔性基材的第一主表面。

著录项

  • 公开/公告号US2012156457A1

    专利类型

  • 公开/公告日2012-06-21

    原文格式PDF

  • 申请/专利权人 SATOSHI KONDO;

    申请/专利号US201213404565

  • 发明设计人 SATOSHI KONDO;

    申请日2012-02-24

  • 分类号B32B7/02;B29C41/42;B32B3/00;

  • 国家 US

  • 入库时间 2022-08-21 17:34:01

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号