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TRL Calibration Method for a Microwave Package And a Set of Standard Packages

机译:微波包装和一组标准包装的TRL校准方法

摘要

A method of calibrating a test platform for microwave packages is provided. According to the invention, the conventional Thru, Reflect and Line standard patterns are replaced by microwave standard packages fulfilling similar functions, the test platform being adapted accordingly. The use of standard packages makes it possible to retain the same electrical interface between each of the packages and the test platform. The invention also relates to a method of determining an electrical length LC of an etched line linking two microwave feeds of a microwave standard package. The standard package may be connected to the test platform. According to the invention, various electrical lengths of the test platform are measured so as to be able to deduce therefrom the electrical length LC of the etched line of the standard package. The invention exhibits the advantage of obtaining the electrical length LC by measurement rather than by modeling.
机译:提供了一种校准用于微波包装的测试平台的方法。根据本发明,常规的直通,反射和线标准图案被实现类似功能的微波标准包装所代替,测试平台也被相应地适配。使用标准包装可以使每个包装和测试平台之间保持相同的电气接口。本发明还涉及确定连接微波标准包装的两个微波进料的蚀刻线的电长度L Sub的方法。标准包装可以连接到测试平台。根据本发明,测量测试平台的各种电长度,以便能够由此推导出标准封装的蚀刻线的电长度L C 。本发明具有通过测量而不是通过建模获得电气长度L C 的优点。

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