Electroless autocatalytic tin plating solution and electroless autocatalytic tin plating method using the same

摘要

Disclosed are an electroless autocatalytic tin plating solution and an electroless autocatalytic tin plating method using the same. The electroless autocatalytic tin plating solution includes: tin salt formed as a tin ion and a ligand having two or more carboxyl groups are bound; and one or more reductants selected from the group consisting of borohydrides delivering electrons to the tin ion to form a tin layer on a target object to be plated.