首页>
外国专利>
FORMATION OF SHALLOW JUNCTIONS BY DIFFUSION FROM A DIELECTRIC DOPED BY CLUSTER OR MOLECULAR ION BEAMS
FORMATION OF SHALLOW JUNCTIONS BY DIFFUSION FROM A DIELECTRIC DOPED BY CLUSTER OR MOLECULAR ION BEAMS
展开▼
机译:由簇或分子离子束介电掺杂扩散形成浅结
展开▼
页面导航
摘要
著录项
相似文献
摘要
A process for forming diffused region less than 20 nanometers deep with an average doping dose above 1014 cm−2 in an IC substrate, particularly LDD region in an MOS transistor, is disclosed. Dopants are implanted into a source dielectric layer using gas cluster ion beam (GCIB) implantation, molecular ion implantation or atomic ion implantation resulting in negligible damage in the IC substrate. A spike anneal or a laser anneal diffuses the implanted dopants into the IC substrate. The inventive process may also be applied to forming source and drain (S/D) regions. One source dielectric layer may be used for forming both NLDD and PLDD regions.
展开▼
机译:在IC衬底中,特别是在MOS晶体管中的LDD区域中,形成深度小于20纳米,平均掺杂剂量大于10 14 Sup> cm -2 Sup>的扩散区的工艺是披露。使用气体团簇离子束(GCIB)注入,分子离子注入或原子离子注入将掺杂剂注入到源介电层中,从而对IC衬底造成的损害可忽略不计。尖峰退火或激光退火将注入的掺杂剂扩散到IC衬底中。本发明的工艺还可以应用于形成源极和漏极(S / D)区域。一个源电介质层可以用于形成NLDD和PLDD区域。
展开▼