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Metal fluid distribution plate with an adhesion promoting layer and polymeric layer

机译:具有助粘层和聚合物层的金属流体分配板

摘要

In at least one embodiment, the present invention provides an electrically conductive fluid distribution plate and a method of making, and system for using, the electrically conductive fluid distribution plate. In at least one embodiment, the plate comprises an electrically conductive fluid distribution plate comprising a metallic plate body defining a set of fluid flow channels configured to distribute flow of a fluid across at least one side of the plate, a metal-containing adhesion promoting layer having a thickness less than 100 nm disposed on the plate body, and a composite polymeric conductive layer disposed on the metal-containing adhesion promoting layer.
机译:在至少一个实施例中,本发明提供了一种导电流体分配板以及制造该导电流体分配板的方法和使用该系统的系统。在至少一个实施例中,该板包括导电流体分配板,该金属流体包括金属板主体,该金属板主体限定了一组流体流动通道,该流体流动通道被配置为将流体的流动分布在该板的至少一侧上,该含金属的粘附促进层具有小于100nm的厚度设置在板体上,以及复合聚合物导电层设置在含金属的粘合促进层上。

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