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Metal fluid distribution plate with an adhesion promoting layer and polymeric layer
Metal fluid distribution plate with an adhesion promoting layer and polymeric layer
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机译:具有助粘层和聚合物层的金属流体分配板
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摘要
In at least one embodiment, the present invention provides an electrically conductive fluid distribution plate and a method of making, and system for using, the electrically conductive fluid distribution plate. In at least one embodiment, the plate comprises an electrically conductive fluid distribution plate comprising a metallic plate body defining a set of fluid flow channels configured to distribute flow of a fluid across at least one side of the plate, a metal-containing adhesion promoting layer having a thickness less than 100 nm disposed on the plate body, and a composite polymeric conductive layer disposed on the metal-containing adhesion promoting layer.
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