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Lens Module And Wafer Level Lens Module Manufacturing Apparatus

机译:镜头模组及晶圆级镜头模组制造装置

摘要

Example embodiments are directed to a lens module manufactured from a wafer and a wafer level lens module manufacturing apparatus. The wafer level lens module manufacturing apparatus to mold lenses on a wafer provided with lens holes includes a first master substrate and a second master substrate disposed such that the wafer is between the first master substrate and the second master substrate. The wafer level lens module manufacturing apparatus also includes lens molding parts that enter the lens holes and are on at least one of the first master substrate and the second master substrate. The lens is molded to have a thickness less than that of the wafer using the first lens molding parts and second lens molding parts, and both surfaces of the lens are inside the lens hole. Therefore, even if wafers provided with lenses are stacked on each other, the lens does not contact the surfaces of the neighboring wafers or the lenses molded on the neighboring wafers.
机译:示例实施例涉及由晶片制造的透镜模块和晶片级透镜模块制造设备。用于在具有透镜孔的晶片上模制透镜的晶片级透镜模块制造设备包括第一主基板和第二主基板,第二主基板被设置为使得晶片位于第一主基板和第二主基板之间。晶片级透镜模块制造装置还包括进入透镜孔并且在第一主基板和第二主基板中的至少一个上的透镜成型部。使用第一透镜成型部和第二透镜成型部将透镜成型为小于晶片的厚度,并且透镜的两个表面都在透镜孔内。因此,即使将具有透镜的晶片彼此堆叠,透镜也不会接触相邻晶片的表面或模制在相邻晶片上的透镜。

著录项

  • 公开/公告号US2011286118A1

    专利类型

  • 公开/公告日2011-11-24

    原文格式PDF

  • 申请/专利权人 JI HO UH;

    申请/专利号US201113111233

  • 发明设计人 JI HO UH;

    申请日2011-05-19

  • 分类号G02B7/02;

  • 国家 US

  • 入库时间 2022-08-21 17:29:59

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