首页> 外国专利> Cooling Of An Electronic Device In An Aircraft By Case-By-Case Single-Phase Or Two-Phase Cooling

Cooling Of An Electronic Device In An Aircraft By Case-By-Case Single-Phase Or Two-Phase Cooling

机译：通过案例单相或两相冷却来冷却飞机中的电子设备

页面导航

摘要
著录项
相似文献

摘要

Cooling of an electronic device in an aircraft by case-by-case single-phase or two-phase cooling;There is proposed a method for cooling an electronic device in an aircraft (11), comprising the following steps:;circulating a coolant in a cooling circuit,;cooling the electronic device (2) by means of the coolant, and;in an aircraft outer-shell heat exchanger, emitting the heat taken up by the coolant. The coolant evaporates, at least partially, during the cooling of the electronic device (2), and condenses in the aircraft outer-shell heat exchanger (7). The coolant circulates in the coolant circuit by natural convection.

机译：通过逐个案例的单相或两相冷却来冷却飞机中的电子设备;提出了一种用于冷却飞机中的电子设备（ 11 ）的方法，包括以下内容步骤：;在冷却回路中循环冷却剂;通过冷却剂冷却电子设备（ 2 ）;以及在飞机外壳热交换器中，散发由冷却剂吸收的热量冷却液。冷却液在电子设备（ 2 ）冷却期间至少部分蒸发，并在飞机外壳热交换器（ 7 ）中冷凝。冷却剂通过自然对流在冷却剂回路中循环。 展开▼

著录项

公开/公告号US2012000630A1

专利类型

公开/公告日2012-01-05

原文格式PDF

申请/专利权人 MATTHIAS REISS;WILSON WILLY CASAS NORIEGA;SEBASTIAN ROERING;
展开▼

申请/专利号US20090995220

发明设计人 MATTHIAS REISS;WILSON WILLY CASAS NORIEGA;SEBASTIAN ROERING;
展开▼

申请日2009-05-13

分类号F28D15/02;F28D15/00;

国家 US

入库时间 2022-08-21 17:28:54

相似文献

专利

外文文献

中文文献

1. 按具体情况通过单相或两相冷却对飞行器中的电子设备进行冷却 [P] . 中国专利： CN102047776A . 2011-05-04

2. 冷却系统、飞机和用于冷却飞机电子设备的方法 [P] . 中国专利： CN107571997A . 2018-01-12

3. COOLING AN ELECTRONIC DEVICE IN AN AIRCRAFT BY CASE-BY-CASE SINGLE-PHASE OR TWO-PHASE COOLING [P] . 欧洲知识产权局专利： EP2289293B1 . 2017-03-01

机译：通过逐例单相或两相冷却来冷却飞机上的电子设备

4. COOLING AN ELECTRONIC DEVICE IN AN AIRCRAFT BY CASE-BY-CASE SINGLE-PHASE OR TWO-PHASE COOLING [P] . 欧洲知识产权局专利： EP2289293A1 . 2011-03-02

机译：通过逐例单相或两相冷却来冷却飞机上的电子设备

5. Cooling of an electronic device in an aircraft on a case-by-case basis by means of a single-phase or two-phase cooling [P] . 德国专利： DE102008025951A1 . 2010-04-29

机译：通过单相或两相冷却逐个冷却飞机中的电子设备

1. Prototype of Coil for HIRFL—CSR Electron Cooling Devices [J] . YangXiaodong, ZhaoHongwei, 等近代物理研究所和兰州重离子加速器实验室年报：英文版 . 2000,第001期

2. Effect of cooling rate on the microstructure of electron beam welded joints of two-phase TiAl-based alloy [J] . 陈国庆, 张秉刚, 何景山, 中国焊接：英文版 . 2007,第002期

3. Two-Phase Cooling Method Using the R134a Refrigerant to Cool Power Electronic Devices [J] . Campbell J.B., Tolbert L.M., Ayers C.W., IEEE Transactions on Industry Applications . 2007,第3期

4. Single-Phase and Two-Phase Hybrid Cooling Schemes for High-Heat-Flux Thermal Management of Defense Electronics [J] . Myung Ki Sung, Issam Mudawar Journal of Electronic Packaging . 2009,第2期

5. Numerical modeling and experimental validation of two-phase microfluidic cooling in silicon devices for vertical integration of microelectronics [J] . Lorenzini Daniel, Joshi Yogendra International Journal of Heat and Mass Transfer . 2019,第AUGa期

6. Establishing the Single-Phase Cooling Limit for Liquid-Cooled High Performance Electronic Devices [C] . Gamal Refai-Ahmed, Hoa Do, Yaser Hadad, Electronics Packaging Technology Conference . 2020

7. Numerical Analysis of Single-Phase Heat Transfer on Micro Pin Fin Arrays for Liquid Electronic Cooling Application [D] . Ramachandran, Dinesh. 2018

8. Single-Sided Digital Microfluidic (SDMF) Devices for Effective Coolant Delivery and Enhanced Two-Phase Cooling [O] . Sung-Yong Park, Youngsuk Nam 2017

9. Two-Phase Cooling Method Using R134a Refrigerant to Cool Power Electronic Devices [O] . Jeremy B. Campbell, Leon M. Tolbert, Curt W. Ayers, 2014

10. Modeling Single-Phase and Boiling Liquid Jet Impingement Cooling in Power Electronics [R] . Narumanchi, S. V., Hassani, V., Bharathan, D. 2005

1. Air Cooling of Mini-Channel Heat Sink in Electronic Devices [J] . Mousa M. Mohamed ,Mostafa A. Abd El-Baky . 电子器件冷却与温度控制期刊（英文） . 2013,第2期

2. Design Methodology for the Micronozzle-Based Electrospray Evaporative Cooling Devices [J] . Hsiu-Che Wang ,Alexander V. Mamishev . 电子器件冷却与温度控制期刊（英文） . 2012,第2期

3. Effect of Heat Extraction by Metal Lines and Two Sided Cooling on Temperatures in Organic Light Emitting Diode Based Devices [J] . Deepak . ,Gokaran Nath Shukla . 电子器件冷却与温度控制期刊（英文） . 2011,第3期

4. 民用飞机电子设备舱通风冷却系统研究 [C] . Zhang Jibin ,张继斌 ,Nie Lei . 2016第五届民用飞机航电系统国际论坛 . 2016

5. 高温金属物体单相及气液两相喷雾非稳态冷却换热特性 [A] . Muhammad Aamir . 2014