Method for Fast Macropore Etching in n-Type Silicon

摘要

Method for the electrochemical etching of macropores in n-type silicon wafers, using illumination of the wafer reverse sides and using an aqueous electrolyte, characterized in that the electrolyte is an aqueous acetic acid solution with the composition of H₂O: CH₃COOH in the range between 2:1 and 7:3, with an addition of at least 9 percent by weight hydrofluoric acid.