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Pulse-laser bonding method for through-silicon-via based stacking of electronic components
Pulse-laser bonding method for through-silicon-via based stacking of electronic components
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机译:基于硅通孔的电子元件堆叠的脉冲激光键合方法
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摘要
There is described a method of forming a through-silicon-via to form an interconnect between two stacked semiconductor components using pulsed laser energy. A hole is formed in each component, and each hole is filled with a plug formed of a first metal. One component is then stacked on another component such that the holes are in alignment, and a pulse of laser energy is applied to form a bond between the metal plugs.
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