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Interface techniques for coupling a sensor to a readout circuit

机译:用于将传感器耦合到读出电路的接口技术

摘要

Techniques are disclosed that can be used to interface a sensor circuit with readout circuitry. The techniques can be employed, for instance, with microchannel plate (MCP) based devices used in numerous sensing/detection applications, and are particularly suitable for applications where it is desirable to interface an MCP having a relatively large active area to a readout circuit having a relatively smaller active area. The interface effectively decouples anode geometry from readout circuit geometry and also may be configured with flexible anode pad geometry, which allows for compensation of optical blur variations as well as a very high fill factor. The interface can be made using standard semiconductor materials and photolithography techniques and can be configured with thermal expansion qualities that closely track or otherwise match that of the readout circuitry.
机译:公开了可用于使传感器电路与读出电路接口的技术。例如,该技术可以与在许多传感/检测应用中使用的基于微通道板(MCP)的设备一起使用,并且特别适用于需要将具有相对较大有源区域的MCP连接到具有相对较小的活动区域。该接口有效地将阳极几何形状与读出电路几何形状解耦,并且还可以配置有灵活的阳极焊盘几何形状,从而可以补偿光学模糊变化以及非常高的填充系数。该接口可以使用标准的半导体材料和光刻技术制成,并且可以配置为具有紧密跟踪或以其他方式匹配读出电路的热膨胀质量。

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