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System and method for implementing a wafer acceptance test (“WAT”) advanced process control (“APC”) with novel sampling policy and architecture

机译:用于以新颖的采样策略和架构实施晶圆验收测试(“ WAT”)高级过程控制(“ APC”)的系统和方法

摘要

System and method for implementing wafer acceptance test (“WAT”) advanced process control (“APC”) are described. In one embodiment, the method comprises performing a key process on a sample number of wafers of a lot of wafers; performing a key inline measurement related to the key process to produce metrology data for the wafers; predicting WAT data from the metrology data using an inline-to-WAT model; and using the predicted WAT data to tune a WAT APC process for controlling a tuning process or a process APC process.
机译:描述了用于实施晶片验收测试(“ WAT”)高级过程控制(“ APC”)的系统和方法。在一个实施例中,该方法包括:对许多晶片中的样本数目的晶片执行关键处理;进行与关键过程相关的关键在线测量,以产生晶圆的计量数据;使用在线到WAT模型从度量数据预测WAT数据;使用预测的WAT数据来调整WAT APC流程,以控制调整流程或流程APC流程。

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