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Molybdenum tubular sputtering targets with uniform grain size and texture

机译:具有均匀晶粒尺寸和织构的钼管状溅射靶

摘要

Molybdenum, sputtering targets and sintering characterized as having no or minimal texture banding or through thickness gradient. The molybdenum sputtering targets having a fine, uniform grain size as well as uniform texture, are high purity and can be micro-alloyed to improved performance. The sputtering targets can be round discs, square, rectangular or tubular and can be sputtered to form thin films on substrates. By using a segment-forming method, the size of the sputtering target can be up to 6 m×5.5 m. The thin films can be used in electronic components such as Thin Film Transistor-Liquid Crystal Displays, Plasma Display Panels, Organic Light Emitting Diodes, Inorganic Light Emitting Diode Displays, Field Emitting Displays, solar cells, sensors, semiconductor devices, and gate device for CMOS (complementary metal oxide semiconductor) with tunable work functions.
机译:钼,溅射靶材和烧结的特征在于没有或仅有最小的织构带或厚度梯度。具有细小,均匀的晶粒尺寸和均匀的织构的钼溅射靶,纯度高,可以进行微合金化以提高性能。溅射靶可以是圆盘,正方形,矩形或管状,并且可以溅射以在基板上形成薄膜。通过使用分段形成方法,溅射靶的尺寸可以达到6m×5.5m。薄膜可用于电子组件,例如薄膜晶体管液晶显示器,等离子显示器面板,有机发光二极管,无机发光二极管显示器,场致发光显示器,太阳能电池,传感器,半导体器件以及用于具有可调整功函数的CMOS(互补金属氧化物半导体)。

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