首页>
外国专利>
Methods for planarizing unevenness on surface of wafer photoresist layer and wafers produced by the methods
Methods for planarizing unevenness on surface of wafer photoresist layer and wafers produced by the methods
展开▼
机译:使晶片光致抗蚀剂层表面上的不平坦度平坦化的方法以及通过该方法生产的晶片
展开▼
页面导航
摘要
著录项
相似文献
摘要
A wafer has a substrate and a photoresist layer thereon with a surface that is planarized by positioning over a starting surface of the photoresist layer a gray-scale mask having a pattern that correlates with a gradient height profile of unevenness present on the starting surface, patterning the photoresist layer using the gray-scale mask to produce the pattern thereof in the photoresist layer which, in effect, produces a profile of evenness in the photoresist layer underlying the gradient height profile of unevenness, and developing the patterned photoresist layer such that only a three-dimensional portion thereof corresponding to the gradient height profile of unevenness located above the profile of evenness is removed which, in effect, leaves behind a resulting surface on the photoresist layer made substantially more even and thus substantially in a planarized condition.
展开▼