BOARD-LEVEL EMI SHIELD WITH ENHANCED THERMAL DISSIPATION

摘要

A substrate (10) having at least one electrical component (11) disposedthereon; a plurality of discrete electrically conductive fastening units (14)disposed in a pattern on the substrate surrounding the at least one electricalcomponent; a board-level electromagnetic interference (EMI) shield (20)comprising an electrically conductive layer (26); a plurality of apertures(23) formed in the board-level EMI shield (20) such that the apertures (23)correspond to the pattern of the electrically conductive fastening units (14);with at least one thermally conductive interface (TCI) material (40) disposedover the at least one electrical component; and wherein the electricallyconductive layer (26) of the board-level EMI shield is in electrical contactwith at least one electrically conductive fastening unit (14).