首页> 外国专利> CLADDING MATERIAL AND ITS FABRICATION METHOD, METHOD FOR MOLDING CLADDING MATERIAL, AND HEAT SINK USING CLADDING MATERIAL

CLADDING MATERIAL AND ITS FABRICATION METHOD, METHOD FOR MOLDING CLADDING MATERIAL, AND HEAT SINK USING CLADDING MATERIAL

机译:包层材料及其制造方法,包层材料的成型方法以及使用包层材料的热沉

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method and a forming method of a cladding material having high thermal conductivity and a small thermal expansion coefficient, and to provide a radiation substrate having high thermal conductivity and the small thermal expansion coefficient using the same.;SOLUTION: The cladding material is constituted by alternately laminating layers 10 formed of a first material, and layers 20 formed of a second material. The thermal expansion coefficient in the second material is smaller than that in the first material. Thermal conductivity in the second material is lower than that in the first material. A total of five or more layers of the layers 10 formed of the first material and the layers 20 formed of the second material are laminated.;COPYRIGHT: (C)2007,JPO&INPIT
机译:解决的问题:提供一种具有高导热率和小热膨胀系数的覆层材料的制造方法和形成方法,并提供一种具有高导热率和小热膨胀系数的辐射基板。解决方案:包层材料由交替层压由第一材料形成的层10和由第二材料形成的层20构成。第二材料中的热膨胀系数小于第一材料中的热膨胀系数。第二材料中的导热率低于第一材料中的导热率。由第一材料形成的层10和由第二材料形成的层20的总共五层或更多层被层压。版权所有:(C)2007,JPO&INPIT

著录项

  • 公开/公告号EP1944116B1

    专利类型

  • 公开/公告日2012-08-01

    原文格式PDF

  • 申请/专利权人 TSUSHIMA EIKI;

    申请/专利号EP20060756591

  • 发明设计人 TSUSHIMA EIKI;

    申请日2006-05-25

  • 分类号B23K20/00;H01L23/373;B23K20/02;B23K20/04;B30B11/02;B32B15/01;

  • 国家 EP

  • 入库时间 2022-08-21 17:17:09

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