首页> 外国专利> CIRCUIT MODULE HAVING ATTACHED METAL CASE, CIRCUIT MODULE ASSEMBLY HAVING ATTACHED METAL CASE, AND METHOD FOR PRODUCING CIRCUIT MODULE HAVING ATTACHED METAL CASE

CIRCUIT MODULE HAVING ATTACHED METAL CASE, CIRCUIT MODULE ASSEMBLY HAVING ATTACHED METAL CASE, AND METHOD FOR PRODUCING CIRCUIT MODULE HAVING ATTACHED METAL CASE

机译:电路模块附带金属外壳,电路模块组装附带金属外壳以及生产电路模块附带金属外壳的方法

摘要

Provided is a more compact circuit module having an attached metal case. The circuit module having an attached metal case is characterized by being provided with: a circuit board having at least four sides; an electronic component mounted to the circuit board; and a metal case attached to the circuit board, covering the electronic component. The circuit module having an attached metal case is further characterized by a metal case land electrode for attaching the metal case being formed in the vicinity of a side on the surface of the circuit board, the metal case land electrode being provided with a main electrode section and a joining material supply section extending in the direction of the side of the circuit board from the main electrode section, and the metal case being joined to the main electrode section by means of the conductive joining material.
机译:提供了具有附接的金属壳体的更紧凑的电路模块。具有附接的金属壳的电路模块的特征在于,设置有:至少具有四个侧面的电路板;安装在电路板上的电子部件;金属盒,其安装在电路板上,覆盖电子部件。具有附接的金属壳体的电路模块的特征还在于,用于附接金属壳体的金属壳体连接电极形成在电路板的表面的一侧附近附近,该金属壳体连接电极设有主电极部。接合材料供给部从主电极部向电路基板侧延伸,金属壳体通过导电性接合材料接合于主电极部。

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