首页> 外国专利> SURFACE-EMITTING LASER WITH SURFACE RELIEF, SURFACE-EMITTING LASER ARRAY, METHOD OF MANUFACTURING A SURFACE-EMITTING LASER, METHOD OF MANUFACTURING A SURFACE-EMITTING LASER ARRAY AND OPTICAL APPARATUS EQUIPPED WITH SAID SURFACE-EMITTING LASER ARRAY

SURFACE-EMITTING LASER WITH SURFACE RELIEF, SURFACE-EMITTING LASER ARRAY, METHOD OF MANUFACTURING A SURFACE-EMITTING LASER, METHOD OF MANUFACTURING A SURFACE-EMITTING LASER ARRAY AND OPTICAL APPARATUS EQUIPPED WITH SAID SURFACE-EMITTING LASER ARRAY

机译:具有表面浮雕的表面发射激光,表面发射激光阵列,制造表面发射激光的方法,制造表面发射激光阵列的方法以及配备有所述表面发射激光阵列的光学仪器

摘要

A method of manufacturing a surface-emitting laser that allows precise alignment of the center position of a surface relief structure and that of a current confinement structure and formation of the relief structure by means of which a sufficient loss difference can be introduced between the fundamental transverse and higher order transverse mode. Removing a dielectric film on the semiconductor layers and a first-etch stop layer along a second pattern, using a second- and third-etch stop layer are conducted in single step after forming the confinement structure. The relief structure is formed by three layers including a lower, middle and upper layer (130, 132, 134) and total thickness of three layers is equal to the optical thickness of an odd multiple of 1/4 wavelength (λ: oscillation wavelength, n: refractive index of the semiconductor layer). The layer right under the lower layer is the second-etch stop layer (128) and the first-etch stop layer (130) is laid right on this etch stop layer.
机译:一种制造表面发射激光器的方法,该方法允许精确地对准表面浮雕结构的中心位置和电流限制结构的中心位置,并形成浮雕结构,由此可以在基本横向透镜之间引入足够的损耗差。和更高阶的横向模式在形成限制结构之后,使用第二和第三蚀刻停止层沿第二图案去除半导体层和第一蚀刻停止层上的电介质膜。浮雕结构由包括下层,中层和上层(130、132、134)的三层组成,三层的总厚度等于1/4波长奇数倍的光学厚度(λ:振荡波长, n:半导体层的折射率。在下层正下方的层是第二蚀刻停止层(128),并且第一蚀刻停止层(130)正好位于该蚀刻停止层上。

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