GLOBAL ALIGNMENT USING MULTIPLE ALIGNMENT PATTERN CANDIDATES

摘要

In order to provide a technique for performing global alignment (detecting position shift and rotation of a wafer) stably and automatically using an optical microscope, as a pattern for global alignment, multiple alignment pattern candidates are calculated (107), multiple data for matching are created for each alignment pattern (108), matching is performed with respect to the data for matching for each alignment pattern in descending order of appropriateness as an alignment pattern with an image (113) based on an image signal from the optical microscope (114), and the amount of position shift and the amount of rotation of the wafer are calculated (116) on the basis of the results of matching (115).